Broadcom Multi-Function Wireless Chip Offers Unprecedented Integration, Performance to Enable Next Generation Connected Devices

Broadcom Ushers in Next Wave of Communications Convergence by Shipping Its Flagship Wi-Fi + Bluetooth + FM Solution to Customers

IRVINE, Calif., July 22, 2008 -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, is ushering in the next wave of communications convergence for mobile devices. The company is now shipping its flagship wireless combination chip, the Broadcom® BCM4325, in production volumes to leading manufacturers of mobile phones and other consumer devices, with end-products expected to appear on store shelves later this year.

As consumers demand mobile devices that provide seamless connectivity to the Internet, broadcast content and peripherals, manufacturers are looking for single-chip solutions that combine communications technologies. Multi-function chips, such as the BCM4325, will account for nearly one-third of all wireless connectivity solutions shipped in 2012 -- underscoring the huge opportunity for companies that can successfully deliver such devices*.

Broadcom's award-winning** BCM4325 was the first connectivity solution to combine Wi-Fi®, Bluetooth® and FM functionality into a single 65 nanometer (nm) silicon die, significantly reducing the board space and power consumption typically required to add all three wireless features to mobile devices. The highly integrated BCM4325 chip also features several breakthrough capabilities that provide better Wi-Fi and Bluetooth performance than discrete solutions. The company is already sampling its second generation combo solutions, which leverage advanced technologies to provide richer communications and connectivity for next generation products. Examples of future functionality could include 802.11n for multimedia and gaming products, GPS for personal navigation devices (PNDs), low energy Bluetooth technology for sensor applications and other technologies in development.

"When it comes to integrating more functions into a single silicon die, few companies can bring together all of the technologies needed to deliver combo devices with uncompromised performance," said Chris Bergey, Director of Broadcom's Embedded Wireless line of business. "Having shipped hundreds of millions of Wi-Fi and Bluetooth chips, Broadcom not only has the market leading silicon, but also offers unique software expertise to ensure that these technologies work well together. This has generated a considerable amount of design momentum in several high-volume consumer markets."

Broadcom's flagship combo chip offers unprecedented levels of integration and performance, which enables capabilities that were previously difficult to implement in mobile devices -- such as carrier-quality voice calls or rich multimedia over Wi-Fi with concurrent stereo transmissions to Bluetooth headsets. Its innovative design includes:

-- The world's first integrated high-power 65nm power amplifier, which delivers the same level of performance as external solutions while using standard, bulk CMOS process technology;

-- Innovative coexistence algorithms to minimize the interference caused by multiple wireless technologies operating on a single chip in the same frequency band; and

-- A unique shared antenna system that intelligently manages the Bluetooth and Wi-Fi radios to further reduce the solution's footprint and improve coexistence with other radio technologies in the same device.

"Today's consumers want mobile phones, portable media players and PNDs that can handle voice, data and even video communications," said Doug McEuen, Senior Wireless Semiconductors Analyst from ABI Research. "Since Wi-Fi, Bluetooth and FM are essential for many of these features, device manufacturers are looking for flexible solutions that combine multiple technologies to save power and board space. With broad wireless expertise and a track record of innovation, Broadcom is well-positioned to succeed in this market."

Product Availability

Broadcom began shipping high volume production quantities of its BCM4325 in the second quarter of 2008. End-products incorporating the chip are expected to become available later this year. As connected devices based on the BCM4325 combo solution hit the market, Broadcom is looking ahead to solutions that target other applications in the wireless ecosystem.

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®.

Broadcom is one of the world's largest fabless semiconductor companies, with 2007 revenue of $3.78 billion, and holds over 2,800 U.S. and 1,200 foreign patents, more than 7,300 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Visit Broadcom at broadcom.com.

Important factors that may cause such a difference for Broadcom in connection with BCM4325 solution include, but are not limited to:

-- the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory;

-- the gain or loss of a key customer, design win or order;

-- the rate at which our present and future customers and end-users adopt Broadcom's Wi-Fi, Bluetooth and FM technologies for mobile applications;

-- the volume of our product sales and pricing concessions on volume sales;

-- our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets;

-- competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products.

Additional factors that may cause Broadcom's actual results to differ materially from those expressed in forward-looking statements include, but are not limited to the list that can be found at: broadcom.com/press/additional_risk_factors/Q32008.php.

Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Wi-Fi® is a trademark of the Wi-Fi Alliance. Bluetooth® is a trademark of the Bluetooth SIG. Any other trademarks or trade names mentioned are the property of their respective owners.

* According to ABI Research, Short Range Wireless Forecast, June 2008

** Winner of a 2008 EDN Innovation Award in the category of "Communications ICs"

SOURCE: Broadcom Corporation; BRCM Mobile & Wireless /PRNewswire-FirstCall via COMTEX News Network/

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